Net Revenues By Market Segment / Channel (a)
(In %) |
Q3 2009 |
Q2 2009 |
Q3 2008 |
Market Segment / Channel: |
|||
Automotive |
12% |
12% |
13% |
Computer |
13% |
13% |
12% |
Consumer |
11% |
11% |
13% |
Industrial & Other |
7% |
8% |
9% |
Telecom |
41% |
41% |
37% |
Total OEM |
84% |
85% |
84% |
Distribution |
16% |
15% |
16% |
Operating Segment
(In Million US$ & %) |
Q3 2009
Net
Revenues |
Q3 2009
Operating
Income
(Loss) |
Q2 2009
Net
Revenues |
Q2 2009
Operating
Income
(Loss) |
Q3 2008
Net
Revenues |
Q3 2008
Operating
Income
(Loss) |
ACCI |
852 |
(36) |
722 |
(77) |
1,085 |
58 |
IMS |
694 |
27 |
595 |
(16) |
901 |
154 |
Wireless (a) |
704 |
(75) |
650 |
(126) |
696 |
22 |
Others (b)(c) |
25 |
(112) |
26 |
(209) |
14 |
(179) |
TOTAL |
2,275 |
(196) |
1,993 |
(428) |
2,696 |
55 |
In Million US$ & % |
First Nine Months 2009 |
First Nine Months 2008 | ||
Product Segment |
Net
Revenues |
Operating
Income
(Loss) |
Net
Revenues |
Operating
Income
(Loss) |
ACCI |
2,201 |
(148) |
3,231 |
118 |
IMS |
1,787 |
22 |
2,538 |
381 |
Wireless |
1,873 |
(307) |
1,454 |
12 |
FMG (Flash Memories Group) |
NA |
NA |
299 |
16 |
Others |
66 |
(583) |
44 |
(586) |
TOTAL |
5,927 |
(1,016) |
7,566 |
(59) |
|
· |
In automotive electronics, ST and Magneti Marelli, part of Fiat Group, signed a memorandum of understanding that lays the foundations for an agreement to develop power electronics for energy-conversion systems for hybrid and electric vehicles. The future development is to be based on the existing collaboration between the two companies for KERS (Kinetic Energy Recovery System), used in Formula 1 motor racing. |
|
· |
ST received an Automotive Supplier of the Year 2008 Award from Continental, one of the world’s leading car-equipment makers. ST was chosen for its excellent supplier performance in all key aspects, including technology, cost competitiveness and logistics, across a broad range of product categories. |
|
· |
ST gained design wins for next-generation motor-driver ICs from leading tier-one automotive OEMs, for applications including an engine-control system, an innovative shift-by-wire system and a next-generation electronic control unit for power steering. |
|
· |
ST’s latest smart driver IC for diesel glow plugs gained three key design wins from leading global car makers via two of the Company’s major automotive OEM customers in Europe and Japan. Additionally, ST’s strong position in door modules was confirmed with design wins from four tier-one OEMs in Europe and another in Japan. |
|
· |
In automotive infotainment, ST gained an important design win for an audio amplifier IC for use by a leading car maker in Europe to be implemented in ‘stop-start’ cars, which are designed for fuel-emission reduction. ST also gained an important design win for its digital car-radio receiver kit from a major car infotainment maker in Japan. |
|
· |
In automotive GPS applications, ST gained two design wins for its GPS solutions used in tier-one telematic box suppliers for vehicles sold in Brazil from early 2010. The telematic box is a key enabler for Brazil’s anti-theft program. ST also introduced Cartesio+, an application processor with embedded GPS, for next-generation in-car and portable navigation systems. |
|
· |
In digital consumer, ST gained design wins in multiple markets for set-top box (STB) platforms, including several top-tier telecom and cable operators in Europe for their deployment of high-definition TV (HDTV) STBs; and the supply of HDTV DVB-S2 decoders for ‘Free-to-Air’ satellite STBs in Germany. |
|
· |
ST also continued its penetration of markets worldwide for MPEG-2 decoder platforms with design wins and production ramp up in China, Africa, Mexico and South America, in addition to the digital terrestrial TV market in Europe. ST also continued to penetrate the Indian market with two design wins for standard-definition MPEG-4 ICs. |
|
· |
ST introduced a single-chip DVB-T silicon tuner which addresses the growing global demand for digital STBs and integrated digital TVs, as countries worldwide switch from analog to digital TV broadcasting. |
|
· |
ST completed a demonstrator platform based on the proposed HbbTV (Hybrid Broadcast and Broadband TV) European standard for next-generation STBs capable of receiving interactive digital television services via broadcast or broadband Internet connections. ST’s also developed a demo for its low-power initiative, which showed how an operator can maximize power savings in STBs with an industry-leading standby power
consumption of less than one Watt, and a return to full normal operation from standby in less than six seconds. |
|
· |
In display technology, ST expanded its market share for DisplayPort-based monitor applications with three new design wins for its highly integrated premium LCD scalers and three design wins for its DisplayPort converter products. ST also demonstrated its ‘SmartISP’ technology, which updates monitor firmware over digital display interfaces such as DisplayPort, up to five times faster than traditional In-System
Programming methods, and helps customers reduce the cost and complexity of upgrading software during production or in the field. |
|
· |
In consumer audio, ST introduced a new 50W+50W stereo class-D amplifier IC, which uses ST’s proprietary BCD technology to deliver high power output with audiophile sound quality for slim-line TVs and home audio equipment. The chip has already been selected by several original-design companies in China for integration by two leading consumer equipment makers in Japan in micro home-audio systems and docking applications. |
|
· |
In computer peripherals, ST gained design wins from two leading hard-disk-drive manufacturers for next-generation motor-controller IC, manufactured in ST’s BCD technology, for enterprise-computing applications. |
|
· |
In healthcare, ST’s partner, Veredus, launched VereFlu™, the first commercial product based on ST’s lab-on-chip In-Check platform. Already being validated by several research institutes and hospitals in Asia, VereFlu is a DNA test that detects multiple influenza pathogens, including the H1N1 virus. |
|
· |
In industrial markets, Siemens named ST as one of its three best suppliers worldwide for 2009. The Company was honored by Siemens as its most innovative supplier, due to ST’s technology leadership in semiconductors and its close relationship with Siemens for the development of components for industrial automation. |
|
· |
In mobile payment applications, ST signed an agreement with Stollmann, a leading supplier of communication-protocol software, to offer turnkey NFC (Near Field Communications) interface solutions, including all the necessary hardware and software, to leading manufacturers of handsets and mobile consumer devices |
|
· |
In microcontrollers, ST introduced the STM8L product family combining its high-performance 8-bit architecture with its ultra-low-power innovations to save power in active modes as well as when idle. |
|
· |
ST also extended its leading-edge 32-bit STM32 MCU portfolio by introducing the STM32W family, which features an integrated IEEE 802.15.4 2.4GHz radio supporting multiple communications protocols including ZigBee, to deliver a System-on-Chip platform supporting embedded wireless sensor-network design. |
|
· |
In MEMS (Micro Electro-Mechanical Systems), ST gained an important design-in for its leading-edge gyroscopes with a top-tier game console maker, design wins for its motion-sensing accelerometers in TV and STB remote controls, and also for a tablet PC application. Also in MEMS, ST introduced the MotionBee™ platform, which combines accelerometer-based motion sensing with ZigBee wireless technology in a single ultra-compact
module. MotionBee enables the cost-effective building of wireless sensor networks for remote motion recognition and tracking applications. |
|
· |
In power conversion ICs, an ultra-high-efficiency power-management IC from ST was chosen by a major Taiwanese company as a companion chip for the integrated-graphics processing in notebook PCs. ST also gained a design win for a motor-driver IC in a professional autofocus-lens module from a major Korean manufacturer of digital still cameras. |
|
· |
Also in power applications, ST gained several design wins for power MOSFETs in computing, automotive and industrial applications, and for IGBTs and power bipolar transistors in several different industrial power applications. Additionally, ST achieved a key design win for its power management ICs in active-matrix organic-LED display applications from a leading manufacturer in Korea. |
|
· |
In AC switching products, ST extended its range of full-specification 150°C high-junction-temperature TRIACs, with a new ‘sensitive’ series aimed at kitchen appliances that require hot operating conditions while being driven by small power supplies, such as coffee makers and food blenders. |
|
· |
In advanced radio-frequency (RF) passive IC technology, ST is winning orders from world-class consumer makers of portable multimedia devices for its ultra-miniature RF IPDs (Integrated Passive Devices). In addition to IPD technology’s ability to deliver savings in board space of more than 70%, designers can also benefit from optimal power matching and limited insertion loss, avoiding the performance
variations offered by the individual discrete components that are often used in consumer products. ST also provides IPD software kits providing reliable simulation up to 20GHz. |
|
· |
In advanced analog, ST introduced an over-voltage protection IC for use in battery-powered rechargeable portable devices. The chip offers a choice of four threshold voltages and meets several international standards in the drive towards universal power chargers. Also, ST gained design wins for temperature sensors for e-book applications, and switching ICs in notebooks from world-leading computer maker and in mobile
phones from a leading maker in Korea. |
|
· |
In analog linear and interfaces ICs, ST gained multiple design wins across all sectors, including several for op amps in applications from smart phones to motor control. ST also introduced a battery-condition monitoring IC for portable consumer products, enabling increased accuracy for ‘fuel-gauge’ style indicators. This chip also gained an important design win from a world-leading consumer brand in Japan. |
|
· |
During the quarter, an additional top tier manufacturer has selected ST-Ericsson’s U8500 platform for its smartphone development. |
|
· |
In September, ST-Ericsson and Dell signed a strategic relationship agreement to bring high-speed mobility to the Chinese computing market. The recently launched Dell Inspiron |
|
|
Mini 10 Netbook is based on ST-Ericsson’s TD-HSPA platform, T7210. As part of the agreement, Dell and ST-Ericsson will extend their cooperation to other devices based on the next-generation TD-SCDMA platform solutions from ST-Ericsson. |
|
· |
The company also extended its cooperation with Hojy Wireless. It has selected ST-Ericsson’s dual-mode TD-HSPA/EDGE flexible modem, M6718, for the next generation of high-speed mobile broadband for the Chinese market. |
|
· |
In September, ST-Ericsson announced the world’s smallest solution for connectivity on mobile handsets: the CG2900, the world’s first 45nm single-chip solution for Bluetooth, FM and GPS. ST-Ericsson also introduced a new highly integrated ultra-low power Wireless LAN device, the CW1100. |
|
· |
The company also continued to drive innovation in the TD (time division) market by delivering the industry’s first TD-HSPA modem chip samples in 65nm. |
|
· |
Effect of the current economic conditions impacting on demand in the key application markets and from key customers served by our products, and changes in customer order patterns, including order cancellations, all of which generate uncertainties and make it extremely difficult to accurately forecast and plan our future business activities; |
|
· |
our ability to adequately utilize and operate our manufacturing facilities at sufficient levels to cover fixed operating costs, as well as the financial impact of obsolete or excess inventories if actual demand differs from our anticipations; |
|
· |
the impact of intellectual-property claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; |
|
· |
the outcome of ongoing litigation as well as any new litigation to which we may become a defendant; |
|
· |
our ability to successfully integrate the acquisitions we pursue, in particular the successful integration and operation of ST-Ericsson in the current difficult economic environment; |
|
· |
we hold significant non-marketable equity investments in Numonyx, our joint venture in the flash-memory market segment, and in ST-Ericsson, our joint venture in the wireless segment. Additionally, we are a guarantor for certain Numonyx debts. Therefore, declines in these market segments could result in significant impairment charges, restructuring charges and gains/losses on equity investments; |
|
· |
our ability to manage in an intensely competitive and cyclical industry, where a high percentage of our costs are fixed and are incurred in currencies other than U.S. dollars, especially in light of the recent weakening of the U.S. dollar and volatility in the foreign exchange markets; |
|
· |
our ability to execute our restructuring initiatives in accordance with our plans if unforeseen events require adjustments or delays in implementation; |
|
· |
our ability, in an intensively competitive environment, to secure customer acceptance and to achieve our pricing expectations for high-volume supplies of new products in whose development we have been, or are currently, investing; |
|
· |
the ability to maintain solid, viable relationships with our suppliers and customers in the event they are unable to maintain a competitive market presence due, in particular, to the effects of the current economic environment; |
|
· |
changes in the political, social or economic environment, including as a result of military conflict, social unrest and/or terrorist activities, economic turmoil, as well as natural events such as severe weather, health risks, epidemics (including the potential impact of swine flu on our operations or those of our customers) or earthquakes in the countries in which we, our key customers or our suppliers,
operate; and |
|
· |
changes in our overall tax position as a result of changes in tax laws or the outcome of tax audits, and our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets. |
Q3 2009
(US$ millions and cents per share) |
Gross Profit |
Operating
Income (Loss) |
Net Earnings
(Loss) |
Corresponding
EPS |
U.S. GAAP |
713 |
(196) |
(201) |
(0.23) |
Impairment & Restructuring |
53 |
45 |
||
Estimated Income Tax Effect |
3 | |||
Non-U.S GAAP |
713 |
(143) |
(153) |
(0.17) |
Q2 2009
(US$ millions and cents per share) |
Gross Profit |
Operating
Income (Loss) |
Net Earnings
(Loss) |
Corresponding
EPS |
U.S. GAAP |
520 |
(428) |
(318) |
(0.36) |
Impairment & Restructuring |
86 |
74 |
||
Other-Than-Temporary-Impairment |
13 | |||
Estimated Income Tax Effect |
(12) | |||
Non-U.S GAAP |
520 |
(342) |
(243) |
(0.28) |
Q3 2008
(US$ millions and cents per share) |
Gross Profit |
Operating
Income (Loss) |
Net Earnings
(Loss) |
Corresponding
EPS |
U.S. GAAP |
959 |
55 |
(289) |
(0.32) |
NXP Wireless Inventory Step-Up |
57 |
57 |
57 |
|
NXP Wireless In-Process R&DT |
76 |
76 |
||
Impairment & Restructuring |
22 |
22 |
||
Other-Than-Temporary-Impairment |
14 | |||
Numonyx Impairment |
300 | |||
Estimated Income Tax Effect |
(46) | |||
Non-U.S GAAP |
1,016 |
210 |
134 |
0.15 |
Net Financial Position (in US$ millions) |
September 26,
2009 |
June 27,
2009 |
December 31,
2008 |
Cash and cash equivalents, net of bank overdrafts |
1,576 |
1,685 |
989 |
Marketable securities, current |
955 |
759 |
651 |
Restricted cash |
250 |
250 |
250 |
Marketable securities, non-current |
170 |
170 |
242 |
Total financial resources |
2,951 |
2,864 |
2,132 |
Current portion of long-term debt |
(230) |
(174) |
(123) |
Long-term debt |
(2,455) |
(2,485) |
(2,554) |
Total financial debt |
(2,685) |
(2,659) |
(2,677) |
Net financial position |
266 |
205 |
(545) |
Net Operating Cash Flow (in US$ millions) |
Q3 2009 |
Q2 2009 |
Q3 2008 |
Net cash from (used in) operating activities |
225 |
156 |
414 |
Net cash from (used in) investing activities |
(311) |
111 |
(1,664) |
Payment for purchases of / proceeds from sale of marketable securities, short-term deposits and restricted cash, net |
181 |
(251) |
(127) |
Net operating cash flow |
95 |
16 |
(1,377) |
Net operating cash flow (ex M&A) |
100 |
45 |
140 |
STMicroelectronics N.V. |
||||||||
Consolidated Statements of Income |
||||||||
(in million of U.S. dollars, except per share data ($)) |
||||||||
Three Months Ended |
||||||||
(Unaudited) |
(Unaudited) |
|||||||
September 26, |
September 27, |
|||||||
2009 |
2008 |
|||||||
Net sales |
2,269 | 2,687 | ||||||
Other revenues |
6 | 9 | ||||||
NET REVENUES |
2,275 | 2,696 | ||||||
Cost of sales |
(1,562 | ) | (1,737 | ) | ||||
GROSS PROFIT |
713 | 959 | ||||||
Selling, general and administrative |
(290 | ) | (297 | ) | ||||
Research and development |
(595 | ) | (602 | ) | ||||
Other income and expenses, net |
29 | 17 | ||||||
Impairment, restructuring charges and other related closure costs |
(53 | ) | (22 | ) | ||||
Total Operating Expenses |
(909 | ) | (904 | ) | ||||
OPERATING INCOME (LOSS) |
(196 | ) | 55 | |||||
Oher-than-temporary impairment charge on financial assets |
- | (14 | ) | |||||
Interest income, net |
4 | 8 | ||||||
Loss on equity investments |
(42 | ) | (344 | ) | ||||
LOSS BEFORE INCOME TAXES |
(234 | ) | (295 | ) | ||||
AND NONCONTROLLING INTEREST |
||||||||
Income tax benefit (expense) |
(15 | ) | 15 | |||||
LOSS BEFORE NONCONTROLLING INTEREST |
(249 | ) | (280 | ) | ||||
Net loss (income) attributable to noncontrolling interest |
48 | (9 | ) | |||||
NET LOSS ATTRIBUTABLE TO PARENT COMPANY |
(201 | ) | (289 | ) | ||||
LOSS PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS |
(0.23 | ) | (0.32 | ) | ||||
LOSS PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS |
(0.23 | ) | (0.32 | ) | ||||
NUMBER OF WEIGHTED AVERAGE |
||||||||
SHARES USED IN CALCULATING |
878.3 | 890.3 | ||||||
LOSS PER SHARE |
STMicroelectronics N.V. |
||||||||
Consolidated Statements of Income |
||||||||
(in million of U.S. dollars, except per share data ($)) |
||||||||
Nine Months Ended |
||||||||
(Unaudited) |
(Unaudited) |
|||||||
September 26, |
September 27, |
|||||||
2009 |
2008 |
|||||||
Net sales |
5,895 | 7,528 | ||||||
Other revenues |
32 | 38 | ||||||
NET REVENUES |
5,927 | 7,566 | ||||||
Cost of sales |
(4,257 | ) | (4,828 | ) | ||||
GROSS PROFIT |
1,670 | 2,738 | ||||||
Selling, general and administrative |
(856 | ) | (882 | ) | ||||
Research and development |
(1,763 | ) | (1,581 | ) | ||||
Other income and expenses, net |
127 | 56 | ||||||
Impairment, restructuring charges and other related closure costs |
(194 | ) | (390 | ) | ||||
Total Operating Expenses |
(2,686 | ) | (2,797 | ) | ||||
OPERATING LOSS |
(1,016 | ) | (59 | ) | ||||
Oher-than-temporary impairment charge on financial assets |
(72 | ) | (82 | ) | ||||
Interest income, net |
6 | 48 | ||||||
Loss on equity investments |
(324 | ) | (350 | ) | ||||
Loss on sale of financial assets |
(8 | ) | - | |||||
LOSS BEFORE INCOME TAXES |
(1,414 | ) | (443 | ) | ||||
AND NONCONTROLLING INTEREST |
||||||||
Income tax benefit |
142 | 34 | ||||||
LOSS BEFORE NONCONTROLLING INTEREST |
(1,272 | ) | (409 | ) | ||||
Net loss (income) attributable to noncontrolling interest |
211 | (12 | ) | |||||
NET LOSS ATTRIBUTABLE TO PARENT COMPANY |
(1,061 | ) | (421 | ) | ||||
LOSS PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS |
(1.21 | ) | (0.47 | ) | ||||
LOSS PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS |
(1.21 | ) | (0.47 | ) | ||||
NUMBER OF WEIGHTED AVERAGE |
||||||||
SHARES USED IN CALCULATING |
876.4 | 896.8 | ||||||
LOSS PER SHARE |
STMicroelectronics N.V. |
||||||||||||
CONSOLIDATED BALANCE SHEETS |
||||||||||||
As at |
September 26, |
June 27, |
December 31, |
|||||||||
In million of U.S. dollars |
2009 |
2009 |
2008 |
|||||||||
(Unaudited) |
(Unaudited) |
(Audited) |
||||||||||
ASSETS |
||||||||||||
Current assets: |
||||||||||||
Cash and cash equivalents |
1,576 | 1,685 | 1,009 | |||||||||
Marketable securities |
955 | 759 | 651 | |||||||||
Trade accounts receivable, net |
1,422 | 1,228 | 1,064 | |||||||||
Inventories, net |
1,299 | 1,449 | 1,840 | |||||||||
Deferred tax assets |
252 | 298 | 252 | |||||||||
Assets held for sale |
33 | 32 | 0 | |||||||||
Other receivables and assets |
1,054 | 1,051 | 685 | |||||||||
Total current assets |
6,591 | 6,502 | 5,501 | |||||||||
Goodwill |
1,082 | 1,108 | 958 | |||||||||
Other intangible assets, net |
851 | 878 | 863 | |||||||||
Property, plant and equipment, net |
4,177 | 4,247 | 4,739 | |||||||||
Long-term deferred tax assets |
360 | 339 | 373 | |||||||||
Equity investments |
286 | 328 | 510 | |||||||||
Restricted cash |
250 | 250 | 250 | |||||||||
Non-current marketable securities |
170 | 170 | 242 | |||||||||
Other investments and other non-current assets |
435 | 388 | 477 | |||||||||
7,611 | 7,708 | 8,412 | ||||||||||
Total assets |
14,202 | 14,210 | 13,913 | |||||||||
LIABILITIES AND SHAREHOLDERS’ EQUITY |
||||||||||||
Current liabilities: |
||||||||||||
Bank overdrafts |
0 | 0 | 20 | |||||||||
Current portion of long-term debt |
230 | 174 | 123 | |||||||||
Trade accounts payable |
954 | 873 | 847 | |||||||||
Other payables and accrued liabilities |
1,058 | 1,014 | 996 | |||||||||
Dividends payable to shareholders |
53 | 79 | 79 | |||||||||
Deferred tax liabilities |
8 | 51 | 28 | |||||||||
Accrued income tax |
136 | 131 | 125 | |||||||||
Total current liabilities |
2,439 | 2,322 | 2,218 | |||||||||
Long-term debt |
2,455 | 2,485 | 2,554 | |||||||||
Reserve for pension and termination indemnities |
340 | 336 | 332 | |||||||||
Long-term deferred tax liabilities |
23 | 24 | 27 | |||||||||
Other non-current liabilities |
375 | 377 | 350 | |||||||||
3,193 | 3,222 | 3,263 | ||||||||||
Total liabilities |
5,632 | 5,544 | 5,481 | |||||||||
Commitment and contingencies |
||||||||||||
Equity |
||||||||||||
Parent company shareholders’equity |
||||||||||||
Common stock (preferred stock: 540,000,000 shares authorized, not issued; |
1,156 | 1,156 | 1,156 | |||||||||
common stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized, 910,319,305 shares |
||||||||||||
issued, 878,313,997 shares outstanding) |
||||||||||||
Capital surplus |
2,470 | 2,464 | 2,324 | |||||||||
Accumulated result |
2,793 | 2,995 | 4,064 | |||||||||
Accumulated other comprehensive income |
1,255 | 1,108 | 1,094 | |||||||||
Treasury stock |
(377 | ) | (378 | ) | (482 | ) | ||||||
Total parent company shareholders’equity |
7,297 | 7,345 | 8,156 | |||||||||
Noncontrolling interest |
1,273 | 1,321 | 276 | |||||||||
Total equity |
8,570 | 8,666 | 8,432 | |||||||||
Total liabilities and equity |
14,202 | 14,210 | 13,913 |
STMicroelectronics N.V. |
|||||||||
SELECTED CASH FLOW DATA | |||||||||
Cash Flow Data (in US$ millions) |
Q3 2009 | Q2 2009 | Q3 2008 | ||||||
Net Cash from operating activities |
225 | 156 | 414 | ||||||
Net Cash from (used in) investing activities |
(311 | ) | 111 | (1,664 | ) | ||||
Net Cash from (used in) financing activities |
(36 | ) | (71 | ) | 10 | ||||
Net Cash increase (decrease) |
(109 | ) | 205 | (1,268 | ) | ||||
Selected Cash Flow Data (in US$ millions) |
Q3 2009 | Q2 2009 | Q3 2008 | ||||||
Depreciation & amortization |
342 | 335 | 343 | ||||||
Payment for Capital expenditures |
(98 | ) | (74 | ) | (247 | ) | |||
Dividends paid |
(26 | ) | (34 | ) | (80 | ) | |||
Change in inventory, net |
174 | 245 | 46 |
STMicroelectronics N.V. | ||||
Date: October 21, 2009 | By: | /s/ CARLO FERRO | ||
Name: |
Carlo Ferro |
|||
Title: | Executive Vice President and
Chief Financial Officer |